Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8351748 | Mask-less method and structure for patterning photosensitive material using optical fibers | Tzu-Yin Chiu, Simon Tarng | 2013-01-08 | $426,000 |
| 8053178 | Mask-less method and structure for patterning photosensitive material using optical fibers | Tzu-Yin Chiu, Simon Tarng | 2011-11-08 | $378,000 |
| RE42349 | Wafer treating method for making adhesive dies | Chun-Hung Lin, Kuang-Hui Chen, Shih-Wen Chou | 2011-05-10 | |
| 6960491 | Integrated circuit packaging for improving effective chip-bonding area | Chung-Hung Lin, Cho-Liang Chung, Ming-Liang Huang | 2005-11-01 | $4,895,000 |
| 6703075 | Wafer treating method for making adhesive dies | Chung-Hung Lin, Kuang-Hui Chen, Shih-Wen Chou | 2004-03-09 | $21,011,000 |
| 6689638 | Substrate-on-chip packaging process | Chung-Hung Lin, Cho-Liang Chung, Yao-Jung Lee | 2004-02-10 | $25,226,000 |
| 5157951 | Steering lock | Kenneth Chen | 1992-10-27 |