Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960491 | Integrated circuit packaging for improving effective chip-bonding area | Chung-Hung Lin, Ming-Liang Huang, Jesse Huang | 2005-11-01 |
| 6689638 | Substrate-on-chip packaging process | Chung-Hung Lin, Jesse Huang, Yao-Jung Lee | 2004-02-10 |