Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate-on-chip packaging process

Substrate-on-chip packaging process

US Patent 6689638 · Granted Feb 10, 2004

Estimated economic value: $25,226,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Photomask, method of fabricating a photomask, and method of fabricating a semico2025
Apparatus for fabricating a semiconductor device and method for fabricating semi2025
Cleaning apparatus for cleaning surface of photomask2025
Method for removing particles from pellicle and photomask2025
Particle prevention method in reticle pod2025
Cleaning method, method for forming semiconductor structure and system thereof2024
Photomask cleaning tool2024
Apparatus for fabricating a semiconductor device and method for fabricating semi2024
Method for removing particles from pellicle and photomask2023
Cleaning method, method for forming semiconductor structure and system thereof2023
Particle prevention method in reticle pod2023
Curved display and method for binding cover glass of curved display2022