Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7514299 | Chip package structure and manufacturing method thereof | Chun-Hung Lin, Yu-Tang Pan | 2009-04-07 |
| 7510889 | Light emitting chip package and manufacturing method thereof | Yu-Tang Pan, Men-Shew Liu | 2009-03-31 |
| 7436074 | Chip package without core and stacked chip package structure thereof | Yu-Tang Pan, Cheng-Ting Wu, Hui Liu | 2008-10-14 |
| 6703075 | Wafer treating method for making adhesive dies | Chung-Hung Lin, Jesse Huang, Kuang-Hui Chen | 2004-03-09 |