Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7842550 | Method of fabricating quad flat non-leaded package | Chun-Ying Lin, Geng-Shin Shen | 2010-11-30 |
| 7812432 | Chip package with a dam structure on a die pad | Chi-Jin Shih | 2010-10-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7842550 | Method of fabricating quad flat non-leaded package | Chun-Ying Lin, Geng-Shin Shen | 2010-11-30 |
| 7812432 | Chip package with a dam structure on a die pad | Chi-Jin Shih | 2010-10-12 |