Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401318 | Quad flat no-lead package and manufacturing method thereof | — | 2016-07-26 |
| 9318422 | Flat no-lead package and the manufacturing method thereof | — | 2016-04-19 |
| 7812432 | Chip package with a dam structure on a die pad | Po-Kai Hou | 2010-10-12 |