Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300679 | Semiconductor package structure | Yi-Jyun Lee, Duen-Yi Ho, Che-Hung Kuo | 2025-05-13 |
| 12230560 | Semiconductor package structure | Che-Hung Kuo, Tai-Yu Chen | 2025-02-18 |
| 12165961 | Semiconductor package structure | Zheng Zeng, Che-Hung Kuo | 2024-12-10 |
| 12095142 | Semiconductor package having discrete antenna device | Wen-Chou Wu, Yi-Chieh Lin, Chia-Yu Jin | 2024-09-17 |
| 11967570 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2024-04-23 |
| 11908767 | Semiconductor package structure | Che-Hung Kuo, Chia-Hao Hsu | 2024-02-20 |
| 11908759 | Semiconductor device | Nan-Cheng Chen, Che-Ya Chou, Che-Hung Kuo | 2024-02-20 |
| 11776899 | Via array design for multi-layer redistribution circuit structure | Che-Hung Kuo | 2023-10-03 |
| 11721882 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen +1 more | 2023-08-08 |
| 11710688 | Semiconductor package structure | Zheng Zeng, Che-Hung Kuo | 2023-07-25 |
| 11705413 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2023-07-18 |
| 11509038 | Semiconductor package having discrete antenna device | Wen-Chou Wu, Yi-Chieh Lin, Chia-Yu Jin | 2022-11-22 |
| 11302657 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2022-04-12 |
| 11244913 | Semiconductor package | Ying-Chih Chen, Yen-Ju Lu, Che-Ya Chou | 2022-02-08 |
| 11227846 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2022-01-18 |
| 10910323 | Semiconductor package with reduced noise | Sheng-Mou Lin, Wen-Chou Wu | 2021-02-02 |
| 10847869 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen +1 more | 2020-11-24 |
| 10074628 | System-in-package and fabrication method thereof | Che-Ya Chou | 2018-09-11 |
| 9991227 | Bonding pad arrangement design for multi-die semiconductor package structure | Chia-Hao Yang, Ying-Chih Chen | 2018-06-05 |
| 9564395 | Bonding pad arrangment design for multi-die semiconductor package structure | Chia-Hao Yang, Ying-Chih Chen | 2017-02-07 |
| 9129962 | Bonding pad arrangment design for multi-die semiconductor package structure | Chia-Hao Yang, Ying-Chih Chen | 2015-09-08 |