Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9064934 | Barrier layer for copper interconnect | Yu-Hung Lin, Chi-Yu Chou, Kuei-Pin Lee, Chen-Kuang Lien, Yao-Hsiang Liang +1 more | 2015-06-23 |
| 8872342 | Barrier layer for copper interconnect | Yu-Hung Lin, Chi-Yu Chou, Kuei-Pin Lee, Chen-Kuang Lien, Yao-Hsiang Liang +1 more | 2014-10-28 |
| 8722531 | Barrier layer for copper interconnect | Yu-Hung Lin, Chi-Yu Chou, Kuei-Pin Lee, Chen-Kuang Lien, Yao-Hsiang Liang +1 more | 2014-05-13 |