Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10704158 | Electrochemical plating | Lun-Chieh Chiu, Yu-Min Chang | 2020-07-07 |
| 9518332 | Electrochemical plating | Lun-Chieh Chiu, Yu-Min Chang | 2016-12-13 |
| 9064934 | Barrier layer for copper interconnect | Yu-Hung Lin, Chi-Yu Chou, Kuei-Pin Lee, Yu-Chang Hsiao, Yao-Hsiang Liang +1 more | 2015-06-23 |
| 8872342 | Barrier layer for copper interconnect | Yu-Hung Lin, Chi-Yu Chou, Kuei-Pin Lee, Yu-Chang Hsiao, Yao-Hsiang Liang +1 more | 2014-10-28 |
| 8722531 | Barrier layer for copper interconnect | Yu-Hung Lin, Chi-Yu Chou, Kuei-Pin Lee, Yu-Chang Hsiao, Yao-Hsiang Liang +1 more | 2014-05-13 |
| 8673765 | Method and apparatus for back end of line semiconductor device processing | Hung-Chih Wang, Wei-Rong Chen, Yao-Hsiang Liang | 2014-03-18 |