Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672652 | Gradient atomic layer deposition | Chia-Pang Kuo | 2020-06-02 |
| 10529575 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2020-01-07 |
| 10354914 | Global dielectric and barrier layer | — | 2019-07-16 |
| 10312098 | Method of forming an interconnect structure | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2019-06-04 |
| 10276431 | Device and method for reducing contact resistance of a metal | Hung-Wen Su, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2019-04-30 |
| 10163719 | Method of forming self-alignment contact | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Ming-Hsing Tsai, Rueijer Lin +3 more | 2018-12-25 |
| 10163644 | Interconnect structure including a conductive feature and a barrier layer on sidewalls and a bottom surface of the conductive feature and method of forming the same | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2018-12-25 |
| 10079176 | Method of using a barrier-seed tool for forming fine pitched metal interconnects | — | 2018-09-18 |
| 10050116 | Semiconductor device structure and method for forming the same | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Ming-Hsing Tsai, Rueijer Lin +2 more | 2018-08-14 |
| 10043706 | Mitigating pattern collapse | Chih-Yuan Ting, Chung-Wen Wu, Jeng-Shiou Chen | 2018-08-07 |
| 9941199 | Two step metallization formation | Chun-Chieh Lin | 2018-04-10 |
| 9892963 | Device and method for reducing contact resistance of a metal | Hung-Wen Su, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2018-02-13 |
| 9818834 | Semiconductor device structure and method for forming the same | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Ming-Hsing Tsai, Rueijer Lin +2 more | 2017-11-14 |
| 9812397 | Method of forming hybrid diffusion barrier layer and semiconductor device thereof | Kai-Shiang Kuo, Ken-Yu Chang, Hung-Wen Su | 2017-11-07 |
| 9711398 | Global dielectric and barrier layer | — | 2017-07-18 |
| 9659856 | Two step metallization formation | Chun-Chieh Lin | 2017-05-23 |
| 9396992 | Method of using a barrier-seed tool for forming fine-pitched metal interconnects | — | 2016-07-19 |
| 9214383 | Method of semiconductor integrated circuit fabrication | Wen-Jiun Liu, Chien-An Chen, Hung-Wen Su, Minghsing Tsai, Syun-Ming Jang | 2015-12-15 |
| 9209072 | Global dielectric and barrier layer | — | 2015-12-08 |
| 9159666 | Device and method for reducing contact resistance of a metal | Hung-Wen Su, Yu-Hung Lin, Kuei-Pin Lee, Yu-Min Chang | 2015-10-13 |
| 8962473 | Method of forming hybrid diffusion barrier layer and semiconductor device thereof | Kai-Shiang Kuo, Ken-Yu Chang, Hung-Wen Su | 2015-02-24 |
| 8736056 | Device for reducing contact resistance of a metal | Hung-Wen Su | 2014-05-27 |