Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080594 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Cheng-Hui Weng +2 more | 2024-09-03 |
| 11430692 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Cheng-Hui Weng +2 more | 2022-08-30 |
| 8421506 | Output buffer with process and temperature compensation | Chua-Chin Wang, Ron-Chi Kuo, Ming-Dou Ker | 2013-04-16 |
| 8193837 | Corner detector | Chua-Chin Wang, Ron-Chi Kuo, Ming-Dou Ker | 2012-06-05 |