Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293917 | System and method for removing impurities during chemical mechanical planarization | Te-Chien Hou, Po-Chin Nien, Chih-Hung Chen, Kei-Wei Chen | 2025-05-06 |
| 12237402 | Methods of forming semiconductor devices | Shu-Wei Hsu, Yu-Jen Shen, Hao-Yun Cheng, Chih-Wei Wu, Ying-Ho Chen | 2025-02-25 |
| 12237282 | Semiconductor device and method of forming the same | Wei-Huan Fu, Jiun-Jie Huang, Wen-Han Hung, Jen-Pan Wang | 2025-02-25 |
| 11854821 | Hard mask removal method | Che-Hao Tu, William Weilun Hong | 2023-12-26 |
| 11694889 | Chemical mechanical polishing cleaning system with temperature control for defect reduction | Ssutzu Chen, Gin-Chen Huang, Ya-Ting Tsai, Kei-Wei Chen | 2023-07-04 |
| 11515403 | Semiconductor device and method | Shu-Wei Hsu, Yu-Jen Shen, Hao-Yun Cheng, Chih-Wei Wu, Ying-Ho Chen | 2022-11-29 |
| 10971370 | Hard mask removal method | Che-Hao Tu, William Weilun Hong | 2021-04-06 |
| 10541139 | Planarization control in semiconductor manufacturing process | Po-Chin Nien, William Weilun Hong | 2020-01-21 |
| 10522365 | Methods for reducing scratch defects in chemical mechanical planarization | Wan-Chun Pan, William Weilun Hong | 2019-12-31 |
| 10510552 | Hard mask removal method | Che-Hao Tu, William Weilun Hong | 2019-12-17 |
| 10269567 | Multi-layer mask and method of forming same | Teng-Chun Tsai, Yung-Cheng Lu, Tien-I Bao | 2019-04-23 |
| 10068988 | Doped poly-silicon for PolyCMP planarity improvement | William Weilun Hong, Po-Chin Nien | 2018-09-04 |
| 9960050 | Hard mask removal method | Che-Hao Tu, William Weilun Hong | 2018-05-01 |
| 9941109 | Surface treatment in a chemical mechanical process | Chih-Wen Liu, Che-Hao Tu, Po-Chin Nien, William Weilun Hong | 2018-04-10 |
| 9922837 | Asymmetric application of pressure to a wafer during a CMP process | Chih-Wen Liu, Che-Hao Tu, Po-Chin Nien, William Weilun Hong | 2018-03-20 |
| 9871115 | Doped poly-silicon for polyCMP planarity improvement | William Weilun Hong, Po-Chin Nien | 2018-01-16 |
| 9768024 | Multi-layer mask and method of forming same | Teng-Chun Tsai, Yung-Cheng Lu, Tien-I Bao | 2017-09-19 |
| 9755056 | Method for forming semiconductor device | Chih-Kai Hsu, Chao-Hung Lin, Yu-Hsiang Hung, Ssu-I Fu, Shih-Hung Tsai +1 more | 2017-09-05 |
| 9721831 | Method and apparatus for semiconductor planarization | Po-Chin Nien, William Weilun Hong | 2017-08-01 |
| 9711374 | Mechanisms for forming oxide layer over exposed polysilicon during a chemical mechanical polishing (CMP) process | Che-Hao Tu, Chih-Yu Chang, William Weilun Hong | 2017-07-18 |
| 9595450 | Composite structure for gate level inter-layer dielectric | Che-Hao Tu, William Weilun Hong | 2017-03-14 |
| 9384962 | Oxygen treatment of replacement work-function metals in CMOS transistor gates | Guang-Yaw Hwang, Chun-Hsien Lin, Hung-Ling Shih, Jiunn-Hsiung Liao, Zhi-Cheng Lee +13 more | 2016-07-05 |
| 9349833 | Semiconductor device and method of forming the same | Yu-Hsiang Hung, Chao-Hung Lin, Chih-Kai Hsu, Ssu-I Fu, Jyh-Shyang Jenq +1 more | 2016-05-24 |
| 9312365 | Manufacturing method of non-planar FET | Shih-Hung Tsai, Ssu-I Fu, Chih-Wei Chen, Ying-Chih Lin, Chien-Ting Lin +1 more | 2016-04-12 |
| 9278423 | CMP slurry particle breakup | William Weilun Hong, Kuo-Min Lin | 2016-03-08 |