Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237282 | Semiconductor device and method of forming the same | Wei-Huan Fu, Ying-Tsung Chen, Wen-Han Hung, Jen-Pan Wang | 2025-02-25 |
| 10608094 | Semiconductor device and method of forming the same | Fu-Tsun Tsai, I-Chih Chen, Chih-Mu Huang, Jen-Pan Wang | 2020-03-31 |
| 9837348 | Voids in interconnect structures and methods for forming the same | Ling-Sung Wang | 2017-12-05 |
| 9105634 | Voids in interconnect structures and methods for forming the same | Ling-Sung Wang | 2015-08-11 |
| 9064841 | Metal-oxide-metal capacitor apparatus with a via-hole region | Ling-Sung Wang, Chi-Yen Lin | 2015-06-23 |
| 8648341 | Methods and apparatus for testing pads on wafers | Chung-Yuan Yang, Jen-Pan Wang | 2014-02-11 |
| 8558350 | Metal-oxide-metal capacitor structure | Ling-Sung Wang, Chi-Yen Lin | 2013-10-15 |
| 8476629 | Enhanced wafer test line structure | Chi-Yen Lin, Ling-Sung Wang | 2013-07-02 |
| 8468474 | Reducing metal pits through optical proximity correction | Chi-Yen Lin, Ling-Sung Wang | 2013-06-18 |
| 8341562 | Reducing metal pits through optical proximity correction | Chi-Yen Lin, Ling-Sung Wang | 2012-12-25 |