WL

Wen-Kuei Liu

TSMC: 19 patents #1,728 of 12,232Top 15%
AO Au Optronics: 2 patents #1,286 of 2,945Top 45%
UN Unknown: 2 patents #12,644 of 83,584Top 20%
📍 Xiazhangshulin, TW: #2 of 2 inventorsTop 100%
Overall (All Time): #135,402 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 1–25 of 28 patents

Patent #TitleCo-InventorsDate
12368063 Wafer taping apparatus and method Chien-Yi Lee 2025-07-22
11901226 Method for forming an interconnect structure 2024-02-13
11872471 Braking mechanism of a wheeled device Hsiu-Feng Chen, Chao-Hsuan Liu, Yu-Chun Liu, Yi Liu, Yu-Cheng Liu +1 more 2024-01-16
11642754 Slurry recycling for chemical mechanical polishing system 2023-05-09
11430677 Wafer taping apparatus and method Chien-Yi Lee 2022-08-30
11312882 CMP slurry solution for hardened fluid material Kuo-Yin Lin, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin +1 more 2022-04-26
11305839 Transmission device for bicycle Chao-Hsuan Liu, Yu-Chun Liu, Yi Liu 2022-04-19
11244834 Slurry recycling for chemical mechanical polishing system 2022-02-08
11069570 Method for forming an interconnect structure 2021-07-20
11011385 CMP-friendly coatings for planar recessing or removing of variable-height layers Teng-Chun Tsai, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more 2021-05-18
10854468 Method and equipment for performing CMP process 2020-12-01
10774241 CMP slurry solution for hardened fluid material Kuo-Yin Lin, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin +1 more 2020-09-15
10734240 Method and equipment for performing CMP process 2020-08-04
9852899 Wafer back-side polishing system and method for integrated circuit device manufacturing processes Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien +2 more 2017-12-26
9748109 CMP-friendly coatings for planar recessing or removing of variable-height layers Teng-Chun Tsai, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more 2017-08-29
9567493 CMP slurry solution for hardened fluid material Kuo-Yin Lin, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin +1 more 2017-02-14
9559021 Wafer back-side polishing system and method for integrated circuit device manufacturing processes Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien +2 more 2017-01-31
9478431 BARC-assisted process for planar recessing or removing of variable-height layers Teng-Chun Tsai, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more 2016-10-25
9287127 Wafer back-side polishing system and method for integrated circuit device manufacturing processes Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien +2 more 2016-03-15
9281192 CMP-friendly coatings for planar recessing or removing of variable-height layers Teng-Chun Tsai, Kao-Feng Liao, Yu-Ting Yen, Yu-Chung Su 2016-03-08
9236446 Barc-assisted process for planar recessing or removing of variable-height layers Teng-Chun Tsai, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more 2016-01-12
8882296 Light emitting diode module and display device using the same light emitting diode module Sheng-Wen Chen, Yu-Min Hung, Tsai-Fen Lee, Yung-Hsiang Tsao 2014-11-11
8840297 Back-light module Sheng-Wen Chen 2014-09-23
D704527 Steering wheel lock 2014-05-13
D692743 Steering wheel lock 2013-11-05