Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131973 | Semiconductor device and method forming the same | Hsiu-Mei Yu, Guang-Yuan JIANG, Cheng-Yi Hsieh, Chang-Sheng Lin | 2024-10-29 |
| 11935878 | Package structure and method for manufacturing the same | Hsiu-Mei Yu, Guang-Yuan JIANG, Cheng-Yi Hsieh, Chang-Sheng Lin | 2024-03-19 |
| 11810804 | Method of forming dice and structure of die | Hsiu-Mei Yu, Chang-Sheng Lin, Chun-Yi Wu | 2023-11-07 |
| 11588036 | High-efficiency packaged chip structure and electronic device including the same | Hsiu-Mei Yu, Cheng-Yi Hsieh, Chang-Sheng Lin, Chun-Yi Wu | 2023-02-21 |
| 11309201 | Method of forming dice and structure of die | Hsiu-Mei Yu, Chang-Sheng Lin, Chun-Yi Wu | 2022-04-19 |
| 11133246 | Semiconductor structure employing conductive paste on lead frame | Chih-Yen Chen, Hsin-Chang Tsai, Chun-Yi Wu, Chia-Ching Huang, Chih-Jen Hsiao +1 more | 2021-09-28 |