Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9564398 | Chemical direct pattern plating interconnect metallization and metal structure produced by the same | Wen-Jiun Liu, Chen-Yuan Kao, Hung-Wen Su, Syun-Ming Jang | 2017-02-07 |