Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322742 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2025-06-03 |
| 11855066 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2023-12-26 |
| 11508710 | Method of forming semiconductor device package | Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2022-11-22 |
| 11335672 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2022-05-17 |
| 10741537 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2020-08-11 |
| 10714463 | Method of forming semicondcutor device package | Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2020-07-14 |
| 10504880 | Method of forming semicondcutor device package | Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-12-10 |
| 10276551 | Semiconductor device package and method of forming semiconductor device package | Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-04-30 |
| 9502323 | Method of forming encapsulated semiconductor device package | Wen-Yi Lin, Kuo-Chuan Liu, Po-Yao Lin, Ming-Chih Yew | 2016-11-22 |
| 8941248 | Semiconductor device package and method | Wen-Yi Lin, Ming-Chih Yew, Po-Yao Lin, Kuo-Chuan Liu | 2015-01-27 |