Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308338 | Power substrate assembly with reduced warpage | Rhodri Hughes, Robert Ebido, Jeff Grozen, Josef Colquin A. Chua, Domingo Atienza, JR. | 2025-05-20 |
| 12119576 | Press-fit power module and related methods | Jie Chang, Huibin Chen, Keunhyuk LEE | 2024-10-15 |
| 12074160 | Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads | Keunhyuk LEE, Jerome Teysseyre | 2024-08-27 |
| 11908826 | Flexible clip with aligner structure | Keunhyuk LEE, Jerome Teysseyre | 2024-02-20 |
| 11315856 | Leadframe with sockets for solderless pins | Keunhyuk LEE | 2022-04-26 |
| 11222832 | Power semiconductor device package | Keunhyuk LEE, Jerome Teysseyre | 2022-01-11 |
| 10804626 | Press-fit power module and related methods | Jie Chang, Huibin Chen, Keunhyuk LEE | 2020-10-13 |
| 10741480 | Leadframe with sockets for solderless pins | Keunhyuk LEE | 2020-08-11 |
| 10566713 | Press-fit power module and related methods | Jie Chang, Huibin Chen, Keunhyuk LEE | 2020-02-18 |
| 8508025 | Folded leadframe multiple die package | Yong Liu, Hua Yang | 2013-08-13 |
| 8426953 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Margie T. Rios, Hua Yang, Yumin Liu | 2013-04-23 |
| 8198710 | Folded leadframe multiple die package | Yong Liu, Hua Yang | 2012-06-12 |
| 8088645 | 3D smart power module | Yong Liu, Yumin Liu, Hua Yang, Margie T. Rios | 2012-01-03 |
| 8030743 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Margie T. Rios, Hua Yang, Yumin Liu | 2011-10-04 |
| 7952204 | Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same | Yumin Liu, Hua Yang, Yong Liu | 2011-05-31 |
| 7902646 | Multiphase synchronous buck converter | Yong Liu, Hua Yang | 2011-03-08 |
| 7821114 | Multiphase synchronous buck converter | Yong Liu, Hua Yang | 2010-10-26 |
| 7808101 | 3D smart power module | Yong Liu, Yumin Liu, Hua Yang, Margie T. Rios | 2010-10-05 |
| 7696612 | Multiphase synchronous buck converter | Yong Liu, Hua Yang | 2010-04-13 |
| 7586179 | Wireless semiconductor package for efficient heat dissipation | Paul Armand Asentista Calo, Margie T. Rios, Joonseo SON, Erwin Ian V. Almagro | 2009-09-08 |
| 7564124 | Semiconductor die package including stacked dice and heat sink structures | Sangdo Lee | 2009-07-21 |