Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084870 | Semiconductor devices and electrical parts manufacturing using metal coated wires | Yonksuk Kwon, Bin Cai | 2011-12-27 |
| 7564124 | Semiconductor die package including stacked dice and heat sink structures | Tiburcio A. Maldo | 2009-07-21 |