| 11821080 |
Reagents to remove oxygen from metal oxyhalide precursors in thin film deposition processes |
Rocio Alejandra Arteaga Muller, Nicolas Blasco, Jean-Marc Girard, Feng Li, Venkateswara R. Pallem +1 more |
2023-11-21 |
|
| 11661653 |
Vapor delivery systems for solid and liquid materials |
— |
2023-05-30 |
|
| 11577967 |
Tungsten pentachloride conditioning and crystalline phase manipulation |
Feng Li, Sonia Plaza, Jean-Marc Girard, Nicolas Blasco |
2023-02-14 |
|
| 11499014 |
Cureable formulations for forming low-k dielectric silicon-containing films using polycarbosilazane |
Jean-Marc Girard, Peng Zhang, Fan QIN, Gennadiy Itov, Fabrizio Marchegiani +1 more |
2022-11-15 |
|
| 11066310 |
Tungsten pentachloride conditioning and crystalline phase manipulation |
Feng Li, Sonia Plaza, Jean-Marc Girard, Nicolas Blasco |
2021-07-20 |
|
| 10899630 |
Tungsten pentachloride conditioning and crystalline phase manipulation |
Feng Li, Sonia Plaza, Jean-Marc Girard, Nicolas Blasco |
2021-01-26 |
|
| 10710896 |
Tungsten pentachloride conditioning and crystalline phase manipulation |
Feng Li, Sonia Plaza, Jean-Marc Girard, Nicolas Blasco |
2020-07-14 |
|
| 10669160 |
Heterogeneous wet synthesis process for preparation of high purity tungsten pentahalide |
Feng Li, Zhiwen Wan, Claudia Fafard, Stefan Wiese, Guillaume Husson +3 more |
2020-06-02 |
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| 10661351 |
Quick-stop cutting device for a lathe |
Chunzheng DUAN, Wei Sun, Yuwen SUN, Fangyuan ZHANG, Kang Ju |
2020-05-26 |
|
| 8426953 |
Semiconductor package with an embedded printed circuit board and stacked die |
Yong Liu, Margie T. Rios, Hua Yang, Tiburcio A. Maldo |
2013-04-23 |
$5,989,000 |
| 8421204 |
Embedded semiconductor power modules and packages |
Yong Liu, Qiuxiao Qian |
2013-04-16 |
$4,892,000 |
| 8216964 |
Layered support material for catalysts |
Tao Wang, Leslie Wade, Ioan Nicolau, Victor Wong, Barbara F. Kimmich +6 more |
2012-07-10 |
|
| 8088645 |
3D smart power module |
Yong Liu, Hua Yang, Tiburcio A. Maldo, Margie T. Rios |
2012-01-03 |
$6,644,000 |
| 8030743 |
Semiconductor package with an embedded printed circuit board and stacked die |
Yong Liu, Margie T. Rios, Hua Yang, Tiburcio A. Maldo |
2011-10-04 |
$6,129,000 |
| 7973393 |
Stacked micro optocouplers and methods of making the same |
Yong Liu |
2011-07-05 |
$9,323,000 |
| 7952204 |
Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same |
Hua Yang, Yong Liu, Tiburcio A. Maldo |
2011-05-31 |
$3,756,000 |
| 7808101 |
3D smart power module |
Yong Liu, Hua Yang, Tiburcio A. Maldo, Margie T. Rios |
2010-10-05 |
$2,565,000 |
| 7791084 |
Package with overlapping devices |
Yong Liu |
2010-09-07 |
$3,087,000 |
| 7745244 |
Pin substrate and package |
Zhongfa Yuan, Yong Liu, Qiuxiao Qian |
2010-06-29 |
$3,446,000 |
| 7674944 |
Ni catalysts and methods for alkane dehydrogenation |
— |
2010-03-09 |
|
| 7626068 |
Ni catalysts and methods for alkane dehydrogenation |
— |
2009-12-01 |
|
| 7612014 |
Halide free precurors for catalysts |
Tao Wang, Leslie Wade, Ioan Nicolau, Victor Wong, Barbara F. Kimmich +6 more |
2009-11-03 |
|
| 7598198 |
Rhodium containing catalysts |
Tao Wang, Leslie Wade, Ioan Nicolau, Victor Wong, Barbara F. Kimmich +6 more |
2009-10-06 |
|
| 7503515 |
Methods and apparatus for mechanical treatment of materials such as catalysts |
Claus G. Lugmair, Alfred Hagemeyer, Lynn Van Erden, Anthony F. Volpe, Jr., David M. Lowe |
2009-03-17 |
$2,375,000 |
| 7498289 |
Ni catalysts and methods for alkane dehydrogenation |
— |
2009-03-03 |
|