Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11821080 | Reagents to remove oxygen from metal oxyhalide precursors in thin film deposition processes | Rocio Alejandra Arteaga Muller, Nicolas Blasco, Jean-Marc Girard, Feng Li, Venkateswara R. Pallem +1 more | 2023-11-21 |
| 11661653 | Vapor delivery systems for solid and liquid materials | — | 2023-05-30 |
| 11577967 | Tungsten pentachloride conditioning and crystalline phase manipulation | Feng Li, Sonia Plaza, Jean-Marc Girard, Nicolas Blasco | 2023-02-14 |
| 11499014 | Cureable formulations for forming low-k dielectric silicon-containing films using polycarbosilazane | Jean-Marc Girard, Peng Zhang, Fan QIN, Gennadiy Itov, Fabrizio Marchegiani +1 more | 2022-11-15 |
| 11066310 | Tungsten pentachloride conditioning and crystalline phase manipulation | Feng Li, Sonia Plaza, Jean-Marc Girard, Nicolas Blasco | 2021-07-20 |
| 10899630 | Tungsten pentachloride conditioning and crystalline phase manipulation | Feng Li, Sonia Plaza, Jean-Marc Girard, Nicolas Blasco | 2021-01-26 |
| 10710896 | Tungsten pentachloride conditioning and crystalline phase manipulation | Feng Li, Sonia Plaza, Jean-Marc Girard, Nicolas Blasco | 2020-07-14 |
| 10669160 | Heterogeneous wet synthesis process for preparation of high purity tungsten pentahalide | Feng Li, Zhiwen Wan, Claudia Fafard, Stefan Wiese, Guillaume Husson +3 more | 2020-06-02 |
| 10661351 | Quick-stop cutting device for a lathe | Chunzheng DUAN, Wei Sun, Yuwen SUN, Fangyuan ZHANG, Kang Ju | 2020-05-26 |
| 8426953 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Margie T. Rios, Hua Yang, Tiburcio A. Maldo | 2013-04-23 |
| 8421204 | Embedded semiconductor power modules and packages | Yong Liu, Qiuxiao Qian | 2013-04-16 |
| 8216964 | Layered support material for catalysts | Tao Wang, Leslie Wade, Ioan Nicolau, Victor Wong, Barbara F. Kimmich +6 more | 2012-07-10 |
| 8088645 | 3D smart power module | Yong Liu, Hua Yang, Tiburcio A. Maldo, Margie T. Rios | 2012-01-03 |
| 8030743 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Margie T. Rios, Hua Yang, Tiburcio A. Maldo | 2011-10-04 |
| 7973393 | Stacked micro optocouplers and methods of making the same | Yong Liu | 2011-07-05 |
| 7952204 | Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same | Hua Yang, Yong Liu, Tiburcio A. Maldo | 2011-05-31 |
| 7808101 | 3D smart power module | Yong Liu, Hua Yang, Tiburcio A. Maldo, Margie T. Rios | 2010-10-05 |
| 7791084 | Package with overlapping devices | Yong Liu | 2010-09-07 |
| 7745244 | Pin substrate and package | Zhongfa Yuan, Yong Liu, Qiuxiao Qian | 2010-06-29 |
| 7674944 | Ni catalysts and methods for alkane dehydrogenation | — | 2010-03-09 |
| 7626068 | Ni catalysts and methods for alkane dehydrogenation | — | 2009-12-01 |
| 7612014 | Halide free precurors for catalysts | Tao Wang, Leslie Wade, Ioan Nicolau, Victor Wong, Barbara F. Kimmich +6 more | 2009-11-03 |
| 7598198 | Rhodium containing catalysts | Tao Wang, Leslie Wade, Ioan Nicolau, Victor Wong, Barbara F. Kimmich +6 more | 2009-10-06 |
| 7503515 | Methods and apparatus for mechanical treatment of materials such as catalysts | Claus G. Lugmair, Alfred Hagemeyer, Lynn Van Erden, Anthony F. Volpe, Jr., David M. Lowe | 2009-03-17 |
| 7498289 | Ni catalysts and methods for alkane dehydrogenation | — | 2009-03-03 |