Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8674490 | Semiconductor die package including IC driver and bridge | Yong Liu, Jiangyuan Zhang | 2014-03-18 |
| 8421204 | Embedded semiconductor power modules and packages | Yong Liu, Yumin Liu | 2013-04-16 |
| 8389338 | Embedded die package on package (POP) with pre-molded leadframe | Yong Liu | 2013-03-05 |
| 8367481 | Four MOSFET full bridge module | Yong Liu, Jiangyuan Zhang, Mike Speed, JungTae Lee, Luke Huiyong Chung | 2013-02-05 |
| 8138585 | Four mosfet full bridge module | Yong Liu, Jiangyuan Zhang, Mike Speed, JungTae Lee, Huiyong Luke Chung | 2012-03-20 |
| 8063474 | Embedded die package on package (POP) with pre-molded leadframe | Yong Liu | 2011-11-22 |
| 8063472 | Semiconductor package with stacked dice for a buck converter | Yong Liu, William Robert Newberry, Margie T. Rios | 2011-11-22 |
| 8023279 | FLMP buck converter with a molded capacitor and a method of the same | Yong Liu | 2011-09-20 |
| 8018054 | Semiconductor die package including multiple semiconductor dice | Yong Liu | 2011-09-13 |
| 7915721 | Semiconductor die package including IC driver and bridge | Yong Liu, Jiangyuan Zhang | 2011-03-29 |
| 7829988 | Stacking quad pre-molded component packages, systems using the same, and methods of making the same | Yong Liu, Howard Allen | 2010-11-09 |
| 7825502 | Semiconductor die packages having overlapping dice, system using the same, and methods of making the same | Scott Irving, Yong Liu | 2010-11-02 |
| 7768123 | Stacked dual-die packages, methods of making, and systems incorporating said packages | Yong Liu, Howard Allen, Jianhong Ju | 2010-08-03 |
| 7750445 | Stacked synchronous buck converter | Yong Liu, Honorio T. Granada, Jr. | 2010-07-06 |
| 7745244 | Pin substrate and package | Zhongfa Yuan, Yong Liu, Yumin Liu | 2010-06-29 |