Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8110492 | Method for connecting a die attach pad to a lead frame and product thereof | Erwin Ian V. Almagro, Paul Armand Asentista Calo | 2012-02-07 |
| 7800207 | Method for connecting a die attach pad to a lead frame and product thereof | Erwin Ian V. Almagro, Paul Armand Asentista Calo | 2010-09-21 |
| 7750445 | Stacked synchronous buck converter | Yong Liu, Qiuxiao Qian | 2010-07-06 |
| 7101734 | Flip chip substrate design | Rajeev Joshi, Connie Tangpuz | 2006-09-05 |
| 6661082 | Flip chip substrate design | Rajeev Joshi, Connie Tangpuz | 2003-12-09 |