Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7256479 | Method to manufacture a universal footprint for a package with exposed chip | Jonathan Almeria Noquil, Romel N. Manatad, Stephen R. Martin, Rajeev Joshi, Venkat Iyer | 2007-08-14 |
| 7101734 | Flip chip substrate design | Honorio T. Granada, Jr., Rajeev Joshi | 2006-09-05 |
| 6661082 | Flip chip substrate design | Honorio T. Granada, Jr., Rajeev Joshi | 2003-12-09 |