Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8525192 | Die package including substrate with molded device | Yong Liu | 2013-09-03 |
| 8120169 | Thermally enhanced molded leadless package | Yong Liu | 2012-02-21 |
| 8106406 | Die package including substrate with molded device | Yong Liu | 2012-01-31 |
| 7768108 | Semiconductor die package including embedded flip chip | Yong Liu, Jeff Ju, Roger Luo | 2010-08-03 |
| 7745244 | Pin substrate and package | Yong Liu, Yumin Liu, Qiuxiao Qian | 2010-06-29 |
| 7589338 | Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice | Yong Liu, Zhengyu Zhu | 2009-09-15 |