Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9147665 | High bond line thickness for semiconductor devices | Yi-Qun Li, FangFang Yang | 2015-09-29 |
| 7825501 | High bond line thickness for semiconductor devices | Yi-Qun Li, FangFang Yang | 2010-11-02 |
| 7589338 | Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice | Yong Liu, Zhongfa Yuan | 2009-09-15 |