Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9130065 | Power module having stacked flip-chip and method for fabricating the power module | Seungwon IM, O-seob Jeon, Joon-seo Son, Yun Hwa CHOI | 2015-09-08 |
| 8350369 | High power semiconductor package | Seung-won Lim, Sung Min Park, Taek-keun Lee | 2013-01-08 |
| 8258622 | Power device package and semiconductor package mold for fabricating the same | Seung-won Lim, Sung Min Park | 2012-09-04 |
| 8125080 | Semiconductor power module packages with simplified structure and methods of fabricating the same | — | 2012-02-28 |
| 8013431 | Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same | — | 2011-09-06 |
| 7986531 | Power system module and method of fabricating the same | Seung-won Lim, Seung-Han Paek, Sung Min Park | 2011-07-26 |
| 7951645 | Power module for low thermal resistance and method of fabricating the same | O-seob Jeon, Seung-won Lim | 2011-05-31 |
| 7871848 | Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same | — | 2011-01-18 |
| 7842545 | Semiconductor package having insulated metal substrate and method of fabricating the same | — | 2010-11-30 |
| 7808103 | Leadless package | Sung Min Park, Seung-won Lim | 2010-10-05 |
| 7714428 | High power semiconductor package and method of making the same | Seung-won Lim | 2010-05-11 |
| 7706146 | Power system module and method of fabricating the same | Seung-won Lim, Seung-Han Paek, Sung Min Park | 2010-04-27 |
| 7701048 | Power module for low thermal resistance and method of fabricating the same | O-seob Jeon, Seung-won Lim | 2010-04-20 |
| 7675148 | Power module having stacked flip-chip and method of fabricating the power module | Seung-won Lim, O-seob Jeon, Joon-seo Son, Yun Hwa CHOI | 2010-03-09 |
| 7659559 | Semiconductor package having insulated metal substrate and method of fabricating the same | — | 2010-02-09 |
| 6774465 | Semiconductor power package module | Ji Hwan Kim, Dae-Woong Chung, O-seob Jeon | 2004-08-10 |
| 6710439 | Three-dimensional power semiconductor module and method of manufacturing the same | Gi-Young Jeun, O-seob Jeon | 2004-03-23 |