Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387162 | Discrete power transistor package having solderless DBC to leadframe attach | Kang Rim Choi | 2022-07-12 |
| 10720376 | Discrete power transistor package having solderless DBC to leadframe attach | Kang Rim Choi | 2020-07-21 |
| 7501700 | Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same | O-Seob Jeun, Eun Ho Lee, Seung-won Lim | 2009-03-10 |
| 7449774 | Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same | O-Seob Jeun, Eun Ho Lee, Seung-won Lim | 2008-11-11 |
| 7208819 | Power module package having improved heat dissipating capability | Sung Min Park, Joo-Sang Lee, Sung Won LIM, O-seob Jeon, Byoung-ok Lee +2 more | 2007-04-24 |
| 7061080 | Power module package having improved heat dissipating capability | Sung Min Park, Joo-Sang Lee, Sung Won LIM, O-seob Jeon, Byoung-ok Lee +2 more | 2006-06-13 |
| 6710439 | Three-dimensional power semiconductor module and method of manufacturing the same | Keun-hyuk Lee, O-seob Jeon | 2004-03-23 |
| 6365965 | Power semiconductor module with terminals having holes for better adhesion | — | 2002-04-02 |