Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387162 | Discrete power transistor package having solderless DBC to leadframe attach | Gi-Young Jeun | 2022-07-12 |
| 10763201 | Lead and lead frame for power package | Nathan Zommer | 2020-09-01 |
| 10720376 | Discrete power transistor package having solderless DBC to leadframe attach | Gi-Young Jeun | 2020-07-21 |
| 9842795 | Lead and lead frame for power package | Nathan Zommer | 2017-12-12 |
| 9177888 | Electrically isolated power semiconductor package with optimized layout | Thomas Spann, Holger Ostmann | 2015-11-03 |
| 8901723 | Electrically isolated power semiconductor package with optimized layout | Thomas Spann, Holger Ostmann | 2014-12-02 |
| 8796837 | Lead and lead frame for power package | Nathan Zommer | 2014-08-05 |
| 8455987 | Electrically isolated power semiconductor package with optimized layout | Thomas Spann, Holger Ostmann | 2013-06-04 |
| 7459659 | Induction heating circuit and winding method for heating coils | Kyoung Wook Seok | 2008-12-02 |
| 7005734 | Double-sided cooling isolated packaged power semiconductor device | Nathan Zommer | 2006-02-28 |
| 6731002 | High frequency power device with a plastic molded package and direct bonded substrate | — | 2004-05-04 |
| 6727585 | Power device with a plastic molded package and direct bonded substrate | — | 2004-04-27 |
| 6710463 | Electrically isolated power semiconductor package | — | 2004-03-23 |
| 6583505 | Electrically isolated power device package | — | 2003-06-24 |
| 6534343 | Method of making electrically isolated power semiconductor package | — | 2003-03-18 |
| 6404065 | Electrically isolated power semiconductor package | — | 2002-06-11 |