| 11811180 |
Electrical contact for semiconductor package |
Yong Ai-Ong |
2023-11-07 |
| 11798868 |
Metal tab for chip assembly |
— |
2023-10-24 |
| 10446462 |
Heat transfer plate having small cavities for taking up a thermal transfer material |
— |
2019-10-15 |
| 10347549 |
Power semiconductor device module having mechanical corner press-fit anchors |
— |
2019-07-09 |
| 10276472 |
Heat transfer plate having small cavities for taking up a thermal transfer material |
— |
2019-04-30 |
| 10062621 |
Power semiconductor device module having mechanical corner press-fit anchors |
— |
2018-08-28 |
| 10000423 |
Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier |
— |
2018-06-19 |
| 9941256 |
Inverse diode stack |
Frank Ettingshausen, Elmar Wisotzki |
2018-04-10 |
| 9929066 |
Power semiconductor device module baseplate having peripheral heels |
— |
2018-03-27 |
| 9640461 |
Bridging DMB structure for wire bonding in a power semiconductor module |
Ira Balaj-Loos |
2017-05-02 |
| 9443792 |
Bridging DMB structure for wire bonding in a power semiconductor device module |
Ira Balaj-Loos |
2016-09-13 |
| 9177888 |
Electrically isolated power semiconductor package with optimized layout |
Holger Ostmann, Kang Rim Choi |
2015-11-03 |
| 8901723 |
Electrically isolated power semiconductor package with optimized layout |
Holger Ostmann, Kang Rim Choi |
2014-12-02 |
| 8876996 |
Method for the manufacture of double-sided metalized ceramic substrates |
Werner Weidenauer, Heiko Knoll |
2014-11-04 |
| 8455987 |
Electrically isolated power semiconductor package with optimized layout |
Holger Ostmann, Kang Rim Choi |
2013-06-04 |