Thomas Spann has been granted 15 US patents while listed as an inventor at Ixys . The first was granted in 2013 and the most recent in November 2023. Thomas Spann ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Thomas Spann in Fürth, DE.
Patents per Year Patents granted per year, 2013 to 2023 Bar chart with a peak of 4 patents in 2018. peak 4 2013: 1 patents 2013 2014: 2 patents 2014 2015: 1 patents 2015 2016: 1 patents 2016 2017: 1 patents 2017 2018: 4 patents 2018 2019: 3 patents 2019 2023: 2 patents 2023
Issued Patents All Time
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Showing 1–15 of 15 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
11811180 Electrical contact for semiconductor package Yong Ai-Ong 2023-11-07
11798868 Metal tab for chip assembly — 2023-10-24
$15,608,000
10446462 Heat transfer plate having small cavities for taking up a thermal transfer material — 2019-10-15
$1,913,000
10347549 Power semiconductor device module having mechanical corner press-fit anchors — 2019-07-09
$23,092,000
10276472 Heat transfer plate having small cavities for taking up a thermal transfer material — 2019-04-30
10062621 Power semiconductor device module having mechanical corner press-fit anchors — 2018-08-28
10000423 Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier — 2018-06-19
9941256 Inverse diode stack Frank Ettingshausen , Elmar Wisotzki 2018-04-10
9929066 Power semiconductor device module baseplate having peripheral heels — 2018-03-27
9640461 Bridging DMB structure for wire bonding in a power semiconductor module Ira Balaj-Loos 2017-05-02
$1,355,000
9443792 Bridging DMB structure for wire bonding in a power semiconductor device module Ira Balaj-Loos 2016-09-13
$2,656,000
9177888 Electrically isolated power semiconductor package with optimized layout Holger Ostmann , Kang Rim Choi 2015-11-03
$1,615,000
8901723 Electrically isolated power semiconductor package with optimized layout Holger Ostmann , Kang Rim Choi 2014-12-02
$1,404,000
8876996 Method for the manufacture of double-sided metalized ceramic substrates Werner Weidenauer , Heiko Knoll 2014-11-04
8455987 Electrically isolated power semiconductor package with optimized layout Holger Ostmann , Kang Rim Choi 2013-06-04
$3,222,000