Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11811180 | Electrical contact for semiconductor package | Yong Ai-Ong | 2023-11-07 |
| 11798868 | Metal tab for chip assembly | — | 2023-10-24 |
| 10446462 | Heat transfer plate having small cavities for taking up a thermal transfer material | — | 2019-10-15 |
| 10347549 | Power semiconductor device module having mechanical corner press-fit anchors | — | 2019-07-09 |
| 10276472 | Heat transfer plate having small cavities for taking up a thermal transfer material | — | 2019-04-30 |
| 10062621 | Power semiconductor device module having mechanical corner press-fit anchors | — | 2018-08-28 |
| 10000423 | Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier | — | 2018-06-19 |
| 9941256 | Inverse diode stack | Frank Ettingshausen, Elmar Wisotzki | 2018-04-10 |
| 9929066 | Power semiconductor device module baseplate having peripheral heels | — | 2018-03-27 |
| 9640461 | Bridging DMB structure for wire bonding in a power semiconductor module | Ira Balaj-Loos | 2017-05-02 |
| 9443792 | Bridging DMB structure for wire bonding in a power semiconductor device module | Ira Balaj-Loos | 2016-09-13 |
| 9177888 | Electrically isolated power semiconductor package with optimized layout | Holger Ostmann, Kang Rim Choi | 2015-11-03 |
| 8901723 | Electrically isolated power semiconductor package with optimized layout | Holger Ostmann, Kang Rim Choi | 2014-12-02 |
| 8876996 | Method for the manufacture of double-sided metalized ceramic substrates | Werner Weidenauer, Heiko Knoll | 2014-11-04 |
| 8455987 | Electrically isolated power semiconductor package with optimized layout | Holger Ostmann, Kang Rim Choi | 2013-06-04 |