Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8945992 | Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package | Joon-seo Son, O-seob Jeon, Byoung-ok Lee | 2015-02-03 |
| 8350369 | High power semiconductor package | Keun-hyuk Lee, Seung-won Lim, Sung Min Park | 2013-01-08 |
| 8067826 | Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package | Joon-seo Son, O-seob Jeon, Byoung-ok Lee | 2011-11-29 |