Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417999 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Jerome Teysseyre, Seungwon IM | 2025-09-16 |
| 12308364 | Power module package for direct cooling multiple power modules | Jerome Teysseyre, Inpil Yoo | 2025-05-20 |
| 12230601 | High power module package structures | Seungwon IM, Inpil Yoo, Oseob Jeon | 2025-02-18 |
| 12205918 | Submodule semiconductor package | Seungwon IM, Maria Cristina Estacio, Jerome Teysseyre, Inpil Yoo | 2025-01-21 |
| 11984424 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Jerome Teysseyre, Seungwon IM | 2024-05-14 |
| 11848320 | Power module package for direct cooling multiple power modules | Jerome Teysseyre, Inpil Yoo | 2023-12-19 |
| 11430777 | Power module package for direct cooling multiple power modules | Jerome Teysseyre, Inpil Yoo | 2022-08-30 |
| 11264311 | Clips for semiconductor package and related methods | Inpil Yoo, Seungwon IM, Jerome Teysseyre | 2022-03-01 |