Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power module package for direct cooling multiple power modules

Power module package for direct cooling multiple power modules

US Patent 12308364 · Granted May 20, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible clip with aligner structure2025
Semiconductor device modules2025
SiC MOSFET semiconductor packages and related methods2025
Method and system for performing prediction work on target image2025
Power module package2025
Power module package2025
Semiconductor packages using package in package systems and related methods2025
Semiconductor packages using package in package systems and related methods2025
Semiconductor packages using package in package systems and related methods2025
High power module package structures2025
Dual side direct cooling semiconductor package2025
Dual side direct cooling semiconductor package2025