Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10894935 | Composition for removing silicone resins and method of thinning substrate by using the same | Sung-Bae Kim, Baik-Soon Choi, Sue KIM, Young-Taek Hong, Sang Tae Kim +3 more | 2021-01-19 |
| 8723304 | Semiconductor package and methods of fabricating the same | O-seob Jeon, Joon-seo Son | 2014-05-13 |
| 7696004 | Wafer level package fabrication method | Jingli Yuan, Jae-Cheon Doh, Si Joong Yang, Seung Wook Park | 2010-04-13 |