Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848243 | Molded semiconductor package having a substrate with bevelled edge | Joon-seo Son | 2023-12-19 |
| 8552541 | Power device packages having thermal electric modules using peltier effect and methods of fabricating the same | Seung-won Lim, O-soeb Jeon, Joon-seo Son, Byoung-ok Lee | 2013-10-08 |
| 7863725 | Power device packages and methods of fabricating the same | Joon-seo Son, Seung-won Lim, O-soeb Jeon | 2011-01-04 |