TH

Tae-Hoe Hwang

Samsung: 2 patents #37,631 of 75,807Top 50%
Overall (All Time): #2,146,630 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
7374966 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby Min-Ill Kim, Dong-Kuk Kim, Chang-Cheol Lee, Jae-young Hong 2008-05-20
7135353 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby Min-Ill Kim, Dong-Kuk Kim, Chang-Cheol Lee, Jae-young Hong 2006-11-14