Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7988873 | Method of forming a mask pattern for fabricating a semiconductor device | Hyong-Soo Kim | 2011-08-02 |
| 7414303 | Lead on chip semiconductor package | Se-Yong Oh, Jin Ho Kim, Chan-Suk Lee, Min-Keun Kwak, Sung Hwan Yoon +1 more | 2008-08-19 |
| 7148080 | Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package | Pyoung-Wan Kim, Chang-Cheol Lee, Gun Lee | 2006-12-12 |
| 6876029 | Integrated circuit capacitors having doped HSG electrodes | Seung Hwan Lee, Young Sun Kim, Se-Jin Shim, You-Chan Jin, Ju-Tae Moon +7 more | 2005-04-05 |
| 6624069 | Methods of forming integrated circuit capacitors having doped HSG electrodes | Seung Hwan Lee, Young Sun Kim, Se-Jin Shim, You-Chan Jin, Ju-Tae Moon +7 more | 2003-09-23 |
| 6573168 | Methods for forming conductive contact body for integrated circuits using dummy dielectric layer | Ji Soo Kim, Chang-Woong Chu, Dong Hyun Kim, Yong-Chul Oh, Hyoung Joon Kim +2 more | 2003-06-03 |
| 6218260 | Methods of forming integrated circuit capacitors having improved electrode and dielectric layer characteristics and capacitors formed thereby | Seung Hwan Lee, Young Sun Kim, Se-Jin Shim, You-Chan Jin, Ju-Tae Moon +7 more | 2001-04-17 |
| 6077573 | Plasma enhanced chemical vapor deposition methods of forming hemispherical grained silicon layers | Young Sun Kim, Seung Hwan Lee, Young-Wook Park, Mikio Takagi | 2000-06-20 |
| 5932923 | Semiconductor device packages having dummy block leads and tie bars with extended portions to prevent formation of air traps in the encapsulate | Tae Hyeong Kim, Hee Sun Rho, In Sik Cho, Gi Su Yoo | 1999-08-03 |