Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026601 | Encapsulated wafer level package with protection against damage and manufacturing method | — | 2011-09-27 |
| 7906472 | Bleaching and detergent compositions comprising manganese complex prepared from tetra-aza macrocyclic ligands through a convenient synthesis | Han Woong Park, Sang-Yun Lee, Won-Jong Kim, In Sub Baik | 2011-03-15 |
| 5980870 | Herb medicine extract-containing non-bleeding striped dentifrice composition | In Sub Baik, Jong Gi LEE, Youn Woo Park | 1999-11-09 |
| 5932923 | Semiconductor device packages having dummy block leads and tie bars with extended portions to prevent formation of air traps in the encapsulate | Tae Hyeong Kim, Hee Sun Rho, Gi Su Yoo, Sang-Hyeop Lee | 1999-08-03 |
| 5886405 | Semiconductor device package having inner leads with slots | Tae Hyeong Kim, Tae-Sung Park, Hee-Kook Choi | 1999-03-23 |
| 5811132 | Mold for semiconductor packages | Hee Sun Rho, Hee-Kook Choi, Tae-Sung Park | 1998-09-22 |
| 5375162 | Method of making call connection in a private branch exchange system with paging system | Je Woo Kim, Hajime Gikuchi | 1994-12-20 |