Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8735281 | Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same | Chang-Woo Shin, Hyun-Soo Chung, Eun-Chul Ahn, Jin-ho Chun | 2014-05-27 |
| 8456012 | Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same | Chang-Woo Shin, Hyun-Soo Chung, Eun-Chul Ahn, Jin-ho Chun | 2013-06-04 |
| 7969024 | Semiconductor package with joint reliability, entangled wires including insulating material | Hyun-Soo Chung, Jae-Shin Cho, Seong-Deok Hwang, Ki Hyuk Kim | 2011-06-28 |