Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930610 | Semiconductor chip including a bump structure and semiconductor package including the same | Jin-Kuk Bae, Hyun-Soo Chung, In-Young Lee, Chan-Ho Lee | 2021-02-23 |
| 9865552 | Wafer level package | Kyong-Soon Cho | 2018-01-09 |
| 8981514 | Semiconductor package having a blocking pattern between a light transmissive cover and a substrate, and method for fabricating the same | Byoung-Rim Seo, In Won O | 2015-03-17 |
| 8927316 | Camera module and method of manufacturing the camera module | Yong-Hoe Cho, Byoung-Rim Seo, Yung-Cheol Kong | 2015-01-06 |
| 8675118 | Image sensor | — | 2014-03-18 |
| 8547471 | Camera module and method of manufacturing the camera module | Yong-Hoe Cho, Byoung-Rim Seo, Yung-Cheol Kong | 2013-10-01 |
| 8139145 | Camera module | Byoung-Rim Seo, Yung-Cheol Kong | 2012-03-20 |