Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930610 | Semiconductor chip including a bump structure and semiconductor package including the same | Hyun-Soo Chung, Han-Sung Ryu, In-Young Lee, Chan-Ho Lee | 2021-02-23 |
| 10083915 | Semiconductor device | Ki Hyuk Kim, Sang Hyun Lee, Sung Jin Kim, Yong Seo | 2018-09-25 |