Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237309 | Semiconductor package having pads with stepped structure | Myung-Kee Chung, Hyun-Soo Chung | 2025-02-25 |
| 11955464 | Semiconductor package having pads with stepped structure | Myung-Kee Chung, Hyun-Soo Chung | 2024-04-09 |
| 11574892 | Semiconductor package having pads with stepped structure | Myung-Kee Chung, Hyun-Soo Chung | 2023-02-07 |