Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449930 | Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same | Tae Hyeong Kim, Yeong Kwon Ko, Ji Hwang Kim, Sun-kyoung Seo | 2016-09-20 |
| 9412707 | Method of manufacturing semiconductor package | Hyun-Soo Chung, Jung-Seok Ahn, In-Young Lee | 2016-08-09 |
| 9376541 | Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package | Un-Byoung Kang, Kyung Wook Paik, Young Kun Jee, Sun-kyoung Seo, Yong Won Choi +1 more | 2016-06-28 |
| 9343361 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Dong-Hyeon Jang, Ho-Geon Song, Se-Young Jeong, Un-Byoung Kang +1 more | 2016-05-17 |
| 9324683 | Semiconductor package and method of manufacturing the same | Tae Hong Min, Young Kun Jee | 2016-04-26 |
| 9287140 | Semiconductor packages having through electrodes and methods of fabricating the same | Hyunsoo Chung, Jongyeon Kim, In-Young Lee | 2016-03-15 |
| 9171825 | Semiconductor device and method of fabricating the same | Sang-Sick Park, In-Young Lee, Byoung-Soo Kwak, Min Soo Kim, Sang Wook Park | 2015-10-27 |
| 9165916 | Semiconductor package and method of fabricating the same | Hyunsoo Chung, Seungduk Baek, In-Young Lee | 2015-10-20 |
| 9076881 | Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package | Yun-Hyeok Im, Jong-Yeon Kim, Un-Byoung Kang | 2015-07-07 |
| 9070729 | Wafer processing method and method of manufacturing semiconductor device by using the same | Sang-Wook Ji, Hyoung-Yol Mun, Yeong-Iyeol Park | 2015-06-30 |
| 8980689 | Method of fabricating semiconductor multi-chip stack packages | Byoung-Soo Kwak, Cha-Jea Jo, Sang-Uk Han | 2015-03-17 |
| 8902356 | Image sensor module having image sensor package | Byoung-Rim Seo, Beoung-ouk Min, Yung-Cheol Kong, Dong-Min Kim, Ji Woong Park | 2014-12-02 |
| 8852988 | Semiconductor package and method of manufacturing the same | Hyung-Sun Jang, Woon-Seong Kwon, Un-Byoung Kang, Jung-Hwan Kim | 2014-10-07 |
| 8847378 | Semiconductor package | Yun-Seok Choi | 2014-09-30 |
| 8816407 | Semiconductor package | Jong-Yeon Kim, Tae Hong Min, Yeong Kwon Ko | 2014-08-26 |
| 8803334 | Semiconductor package including a semiconductor chip with a through silicon via | Yun-Seok Choi | 2014-08-12 |
| 8643179 | Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package | Yun-Hyeok Im, Jong-Yeon Kim, Un-Byoung Kang | 2014-02-04 |
| 8592991 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Dong-Hyeon Jang, Ho-Geon Song, Se-Young Jeong, Un-Byoung Kang +1 more | 2013-11-26 |
| 8587134 | Semiconductor packages | Yun-Hyeok Im, Won Keun Kim, Kyol Park | 2013-11-19 |
| 8563349 | Method of forming semiconductor device | Jong-Yun Myung, Hyuek Jae Lee, Ji-Sun Hong, Un-Byoung Kang, Hyung-Sun Jang +3 more | 2013-10-22 |
| 8466527 | Semiconductor package and method of manufacturing the same | Hyung-Sun Jang, Woon-Seong Kwon, Un-Byoung Kang, Jung-Hwan Kim | 2013-06-18 |
| 8304288 | Methods of packaging semiconductor devices including bridge patterns | Hyuek Jae Lee, Ji-Sun Hong, Jong-Yun Myung, Young Bok Kim, Hyung-Sun Jang +1 more | 2012-11-06 |
| 8187921 | Semiconductor package having ink-jet type dam and method of manufacturing the same | Choong Bin Yim | 2012-05-29 |
| 8114701 | Camera modules and methods of fabricating the same | Woon-Seong Kwon, Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee, Hyung-Sun Jang | 2012-02-14 |
| 7999368 | Semiconductor package having ink-jet type dam and method of manufacturing the same | Choong Bin Yim | 2011-08-16 |