Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9905538 | Chip-stacked semiconductor package and method of manufacturing the same | Un-Byoung Kang, Tae-Je Cho | 2018-02-27 |
| 9601465 | Chip-stacked semiconductor package and method of manufacturing the same | Un-Byoung Kang, Tae-Je Cho | 2017-03-21 |
| 8164119 | Semiconductor device including conductive lines with fine line width and method of fabricating the same | Hyeoung-Won Seo, Seong-Goo Kim, Sang-Min Jeon | 2012-04-24 |
| 7888720 | Semiconductor device including conductive lines with fine line width and method of fabricating the same | Hyeoung-Won Seo, Seong-Goo Kim, Sang-Min Jeon | 2011-02-15 |
| 7629215 | Semiconductor device and method of manufacturing the same | Soo-Ho Shin, Sun-Hoo Park, Young-Woong Son, Sang Wook Lee | 2009-12-08 |
| 6187676 | Integrated circuit insulated electrode forming methods using metal silicon nitride layers, and insulated electrodes so formed | Min Jung Kim, Sang Cheol Lee | 2001-02-13 |
| 6087233 | Forming trench isolators in semiconductor devices | — | 2000-07-11 |
| 5705440 | Methods of fabricating integrated circuit field effect transistors having reduced-area device isolation regions | Ki-Nam Kim | 1998-01-06 |