Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224272 | Semiconductor package including a rewiring layer with an embedded chip | Jong Bo Shim, Cha-Jea Jo, Won-Il Lee | 2019-03-05 |
| 10199319 | Printed circuit board and semiconductor package including the same | Jong Bo Shim, Sang-Uk Han, Yun-Seok Choi | 2019-02-05 |
| 10192855 | Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line | Sunkyoung Seo, Chajea Jo, Taeje Cho | 2019-01-29 |
| 10141286 | Methods of manufacturing semiconductor packages | Won-Il Lee, Cha-Jea Jo | 2018-11-27 |
| 10026724 | Semiconductor package and method of manufacturing the same | Jong Bo Shim, Sang-Uk Han, Cha-Jea Jo, Gun-ho Chang | 2018-07-17 |
| 9997446 | Semiconductor package including a rewiring layer with an embedded chip | Jong Bo Shim, Cha-Jea Jo, Won-Il Lee | 2018-06-12 |
| 9893018 | Alignment mark for semiconductor device | Yeong Kwon Ko, Tae Hyeong Kim, Sun-kyoung Seo, Tae-Je Cho | 2018-02-13 |
| 9728424 | Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate | Un-Byoung Kang, Cha-Jea Jo, Tae-Je Cho | 2017-08-08 |
| 9646895 | Semiconductor package and manufacturing method thereof | Seungduk Baek, Taeje Cho | 2017-05-09 |
| 9515057 | Semiconductor package and method of manufacturing the semiconductor package | Keum-Hee Ma, Tae-Je Cho | 2016-12-06 |
| 9449930 | Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same | Tae Hyeong Kim, Yeong Kwon Ko, Sun-kyoung Seo, Tae-Je Cho | 2016-09-20 |
| 9425111 | Semiconductor package | Jin-Woo Park, Jongbo Shim | 2016-08-23 |
| 9202767 | Semiconductor device and method of manufacturing the same | Kwang-chul Choi, Sangwon Kim, Tae Hong Min | 2015-12-01 |
| 9159651 | Semiconductor packages having TSV and adhesive layer | Teak-Hoon Lee, Sang Wook Park, Young Kun Jee | 2015-10-13 |
| 9099541 | Method of manufacturing semiconductor device | Sunpil Youn, Sangwon Kim, Kwang-chul Choi, Tae Hong Min | 2015-08-04 |
| 9064941 | Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same | Deok-Young Jung, Pil-Kyu Kang, Byung-Lyul Park, Ji-Soon Park, Seong Min Son +1 more | 2015-06-23 |
| 8963336 | Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same | Deok-Young Jung, Pil-Kyu Kang, Byung-Lyul Park, Ji-Soon Park, Seong Min Son +1 more | 2015-02-24 |
| 8912048 | Method of fabricating semiconductor device including a substrate attached to a carrier | Jong Youn Kim, Hae-Jung Yu, Cha-Jea Jo | 2014-12-16 |
| 8802495 | Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same | Tae Hong Min, Chajea Jo, Taeje Cho, Young Kun Jee, Yun-Seok Choi | 2014-08-12 |