Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869878 | Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire | Wonyoung Kim, Jinchan Ahn | 2024-01-09 |
| 11769746 | Semiconductor package | Ae-Nee Jang, Sunwon Kang | 2023-09-26 |
| 11171119 | Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire | Wonyoung Kim, Jinchan Ahn | 2021-11-09 |
| 10943881 | Semiconductor package | Ae-Nee Jang, Sunwon Kang | 2021-03-09 |
| 10211176 | Semiconductor package | Ae-Nee Jang, Sunwon Kang | 2019-02-19 |