Issued Patents All Time
Showing 26–50 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11468928 | On-die termination of address and command signals | Ian Shaeffer | 2022-10-11 |
| 11398454 | System-in-package module | Ae-Nee Jang, Eunseok Song, Seung-Yong Cha | 2022-07-26 |
| 11349478 | Integrated circuit that applies different data interface terminations during and after write data reception | Ian Shaeffer | 2022-05-31 |
| 11309280 | Semiconductor device package | Yong Hoon Kim, Kil-Soo Kim, Tae-Joo Hwang | 2022-04-19 |
| 11257723 | Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor package | Do Hyun Kim, Sunwon Kang, Hogeon Song | 2022-02-22 |
| 11211105 | Memory device comprising programmable command-and-address and/or data interfaces | Ian Shaeffer, Lawrence Lai, Fan Ho, David A. Secker, Wayne S. Richardson +2 more | 2021-12-28 |
| 11205637 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Ji-Han Ko, Kil-Soo Kim, Yeong Seok Kim, Joung Phil Lee +2 more | 2021-12-21 |
| 11107743 | Chip on film package and display device including the same | Seung-Tae Hwang, Jae Choon Kim, Woon-bae Kim, Jae-Min Jung | 2021-08-31 |
| 11083077 | Structure for delivering power | Ralf M. Schmitt, Yijiong Feng | 2021-08-03 |
| 11063791 | Receiver with clock recovery circuit and adaptive sample and equalizer timing | Qi Lin, Brian S. Leibowitz, Hae-Chang Lee, Jihong Ren, Jared L. Zerbe | 2021-07-13 |
| 11018173 | Image sensor | Ji Hwang Kim | 2021-05-25 |
| 10978374 | Semiconductor package for discharging heat generated by semiconductor chip | Hyunki Kim, Sangsoo Kim, Seung Hwan Kim, Yongkwan Lee, Jongho Lee | 2021-04-13 |
| 10971201 | On-die termination of address and command signals | Ian Shaeffer | 2021-04-06 |
| 10964618 | Semiconductor package and method of manufacturing the same | Jang-woo Lee, Yung-Cheol Kong, Woo Hyun Park, Jong Bo Shim, Jae-myeong Cha | 2021-03-30 |
| 10944400 | On-die termination control | Ian Shaeffer | 2021-03-09 |
| 10879225 | Semiconductor package and method of manufacturing semiconductor package | Won Keun Kim, Hwa-il Jin, Dong Kwan Kim, Yeong Seok Kim, Jae Choon Kim +1 more | 2020-12-29 |
| 10861826 | Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package | Do Hyun Kim, Sunwon Kang | 2020-12-08 |
| 10854551 | Semiconductor package and method of fabricating the same | Hae-Jung Yu | 2020-12-01 |
| 10797021 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Ji-Han Ko, Kil-Soo Kim, Yeong Seok Kim, Joung Phil Lee +2 more | 2020-10-06 |
| 10770124 | Memory device comprising programmable command-and-address and/or data interfaces | Ian Shaeffer, Lawrence Lai, Fan Ho, David A. Secker, Wayne S. Richardson +2 more | 2020-09-08 |
| 10756015 | Semiconductor package, package-on-package device, and method of fabricating the same | Seokhyun Lee | 2020-08-25 |
| 10748871 | Semiconductor chip and semiconductor package including the same | Seong-Hwan Oh, Kilsoo Kim | 2020-08-18 |
| 10727199 | Electronic device including semiconductor device package | Yong Hoon Kim, Kil-Soo Kim, Tae-Joo Hwang | 2020-07-28 |
| 10720196 | On-die termination of address and command signals | Ian Shaeffer | 2020-07-21 |
| 10699983 | Semiconductor package | Kil-Soo Kim, Yong Hoon Kim, Hyun Ki Kim | 2020-06-30 |