Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406934 | Semiconductor package | Sunchul Kim, Hyunki Kim | 2025-09-02 |
| 12132007 | Semiconductor package | Jongwan Kim, Kyong Hwan Koh, Yongkwan Lee | 2024-10-29 |
| 12057357 | Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses | Kyong Hwan Koh, Jongwan Kim, Yongkwan Lee | 2024-08-06 |
| 11581266 | Semiconductor package | Jongwan Kim, Kyong Hwan Koh, Yongkwan Lee | 2023-02-14 |
| 11437326 | Semiconductor package | Sunchul Kim, Hyunki Kim | 2022-09-06 |
| 11217517 | Semiconductor package with a trench portion | Woojin CHOI | 2022-01-04 |
| 10825774 | Semiconductor package | Sunchul Kim, Hyunki Kim | 2020-11-03 |