Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557574 | Semiconductor package | Jinkyeong Seol, Sunchul Kim | 2023-01-17 |
| 11482507 | Semiconductor package having molding member and heat dissipation member | Sunchul Kim, Kyungsuk Oh, Taehun Kim, Soohwan Lee | 2022-10-25 |
| 11309228 | Packaged semiconductor devices having enhanced thermal transport and methods of manufacturing the same | Sunchul Kim, Taehun Kim | 2022-04-19 |
| 11257786 | Semiconductor package including molding member, heat dissipation member, and reinforcing member | Sunchul Kim, Kyungsuk Oh, Taehun Kim | 2022-02-22 |
| 11133296 | Semiconductor package | Chanhee Jeong, Hyunki Kim, Junwoo Park, Byoung Wook Jang, Sunchul Kim +3 more | 2021-09-28 |
| 11075189 | Semiconductor package | Jinkyeong Seol, Sunchul Kim | 2021-07-27 |
| 10622340 | Semiconductor package | Chanhee Jeong, Hyunki Kim, Junwoo Park, Byoung Wook Jang, Sunchul Kim +3 more | 2020-04-14 |
| 10361177 | Semiconductor package having a molding layer including a molding cavity and method of fabricating the same | Yun Young Kim, Hyunki Kim, Junwoo Park, Sangsoo Kim, Seung Hwan Kim +2 more | 2019-07-23 |
| 8026592 | Through-silicon via structures including conductive protective layers | Minseung Yoon, Namseog Kim, Keumhee Ma, Chajea Jo | 2011-09-27 |