Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132019 | Packaged multi-chip semiconductor devices and methods of fabricating same | Hyuekjae Lee, Jongho Lee, Jihoon Kim, Taehun Kim, Sangcheon Park +1 more | 2024-10-29 |
| 11694996 | Semiconductor package including a pad contacting a via | Hyuekjae Lee, Un-Byoung Kang, Sang Cheon Park, Sanghoon Lee | 2023-07-04 |
| 11557574 | Semiconductor package | Sunchul Kim, Pyoungwan Kim | 2023-01-17 |
| 11552033 | Packaged multi-chip semiconductor devices and methods of fabricating same | Hyuekjae Lee, Jongho Lee, Jihoon Kim, Taehun Kim, Sangcheon Park +1 more | 2023-01-10 |
| 11075189 | Semiconductor package | Sunchul Kim, Pyoungwan Kim | 2021-07-27 |
| 10510672 | Semiconductor packages and methods of manufacturing same | Sang-Uk Kim, Sunchul Kim, Byoung Wook Jang | 2019-12-17 |