Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315818 | Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structure | Chulyong Jang | 2025-05-27 |
| 11688667 | Semiconductor package including a pad pattern | — | 2023-06-27 |
| 11626370 | Interconnection structure of a semiconductor chip and semiconductor package including the interconnection structure | Chulyong Jang | 2023-04-11 |
| 11145573 | Semiconductor package including a pad pattern | — | 2021-10-12 |
| 8026592 | Through-silicon via structures including conductive protective layers | Minseung Yoon, Namseog Kim, Pyoungwan Kim, Chajea Jo | 2011-09-27 |